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KMID : 1007519970060030162
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Food Science and Biotechnology
1997 Volume.6 No. 3 p.162 ~ p.166
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Binding of Wood with Soy Flour Formulation
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Lee, Seoung Yong
Rhee, Khee Chun/Park, Sang Kyu/Kim, Kang Sung/Jang, Eun Gyung/Lee, Heong Ock/Ha, Jin Hwan
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Abstract
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Wood adhesives were prepared with defatted soy flour using Lambuth´s method as a basic step, with a slight modification. Adhesive strength of the formulated soy flour adhesive, the break load in ㎏ required to break the glued wood pieces, was measured by an Instron using a compressive method. The compressive method was selected due to the ease in preparation of large quantities of bonded samples and reproducibility of the test results. The wood pieces used in the test were made from maple hard wood and designed 2 ㎝ by 6 ㎝ with a thickness of 0.3 ㎝. Break load of the adhesive was found to deteriorate immediately after the formulation, slowly for the first 5 hrs and rapidly thereafter. SDS electrophoresis pattern revealed a close relationship between decrease in the adhesiveness of the soy flour adhesive with hydrolysis of the protein component in the soy flour, due to high alkalinity of the formulation. Viscosity of the adhesive also dropped rapidly from 4500 mPa to 1400 mPa within 2 hr and levelled off asymptotically to the value of 500 mPa. However high initial viscosity as well as the subsequent decrease was found mainly caused by the hydrolysis of the cell wall components and not protein. Both mechanical bonding and molecular bonding were found to be involved in the adhesion of the wood with the soy glue. Break load value of 60 ㎏ was obtained at the setting time of 30 min and hot pressing condition of 120℃, 4 ㎏/㎠, and 5 min.
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